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    Items for Author "Tsai, Tzu-hsuan" 

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    Showing 11 items.

    Collection Date Title Authors Bitstream
    [化學工程與材料工程學系暨研究所] 專利 2004-12-03 Apparatus of Ion Sensitive Thin Film Transistor and Method of Manufacturing of the Same 蔡子萱; Tsai, Tzu-hsuan; Wu, Yung-fu
    [化學工程與材料工程學系暨研究所] 會議論文 2007-11-26 Electropolishing Mechanisms ofCopper-Plated Wafer in Phosphoric Acid Tsai, Tzu-hsuan; Wu, Y. F.
    [化學工程與材料工程學系暨研究所] 會議論文 2007-05-11 Electrochemical Planarization of Copper-Plated Wafer in Phosphoric Acid Tsai, Tzu-hsuan; Wu, Y. F.
    [化學工程與材料工程學系暨研究所] 期刊論文 2009-01 Metal Removal from Silicon Sawing Waste using the Electrokinetic Method Tsai, Tzu-hsuan; Huang, J. H.
    [化學工程與材料工程學系暨研究所] 期刊論文 2007-12 Effect of Organic Acids on Copper Chemical Mechanical Polishing Wu, Yung-fu; Tsai, Tzu-hsuan
    [化學工程與材料工程學系暨研究所] 期刊論文 2007-04 電化學技術在半導體銅製程中的應用 Tsai, Tzu-hsuan; Yen, S. C.
    [化學工程與材料工程學系暨研究所] 期刊論文 2006-06-01 Wet Etching Mechanisms of ITO Films in Oxalic acid Tsai, Tzu-hsuan; Wu, Y. F.
    [化學工程與材料工程學系暨研究所] 期刊論文 2006-06 Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing Tsai, Tzu-hsuan; Wu, Y. F.; Wu, Y. F.
    [化學工程與材料工程學系暨研究所] 期刊論文 2005-05-01 Glycolic Acid in Hydrogen Peroxide-Based Slurry for Enhancing Copper Chemical Mechanical Polishing Tsai, Tzu-hsuan; Wu,Y. F.; Yen, S. C.
    [化學工程與材料工程學系暨研究所] 期刊論文 2003-05 A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy Tsai, Tzu-hsuan; Wu, Yung-fu; Yen, Shi-chern; Yen, Shi-chern
    [化學工程與材料工程學系暨研究所] 期刊論文 2003-04-15 Localized Corrosion Effects and Modifications of Acidic and Alkaline Slurries on Copper Chemical Mechanical Polishing Tsai, Tzu-hsuan; Yen, Shi-chern

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