Applying the selective Cu electroplating technique to light-emitting diodes

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Title:	Applying the selective Cu electroplating technique to light-emitting diodes
Authors:	Hsu, Shih-Chieh;Chen, Lo-Lin;Lin, Cheng-Lan;Lin, Dar-Jong
Contributors:	淡江大學化學工程與材料工程學系
Keywords:	Electroplating;Selective electroplating;LED;GaN Cu bump
Date:	2014-04-01
Issue Date:	2014-12-11 12:59:22 (UTC+8)
Publisher:	Dordrecht: Springer Netherlands
Abstract:	We successfully fabricated a predefined patterned copper (Cu) substrate for thin GaN light-emitting diodes without barriers by the selective electroplating technique. The contours of Cu bumps fabricated using different electroplating modes and parameters were measured. We observed that the average thickness diminished with increasing current density. The current density conditions to obtain the best upright structure in the process were 40 and 80 mA/cm2.
Relation:	Research on Chemical Intermediates 40(6), pp.2347-2354
DOI:	10.1007/s11164-014-1611-z
Appears in Collections:	[Graduate Institute & Department of Chemical and Materials Engineering] Journal Article

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