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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/98395

    Title: Visualization and thermal resistance of a sintered wicks structure evaporator in a two phase loop thermosyphon
    Authors: KANG, Shung-Wen;HUANG, Chun-Hsien;CHEN, Yu-Tang
    Contributors: 淡江大學機械與機電工程學系
    Keywords: Visualization;Two phase loop thermosyphon;Evaporator resistance;Sintered powder wick;Meniscus receding
    Date: 2014-07
    Issue Date: 2014-07-28 14:03:56 (UTC+8)
    Publisher: Tokyo: Japan Society of Mechanical Engineers
    Abstract: A prototype two-phase loop thermosyphon (TPLT) was built and tested for thermal performance. This experimental study simultaneously investigated the evaporator resistance and flow visualization in operating the TPLT under sub-atmospheric pressure. To facilitate the visualization of flow regime in the evaporator, a transparent glass window was attached to the evaporator. Evaporators with 1-mm-thick sintered copper powder wicks (average diameter, 100 μm) were used. Temperature distribution and evaporator resistance were measured while increasing the input power in a series of 11 steps (20, 60, 100, 120, 140, 160, 180, 200, 220, 240, and 260 W) until the sintered wicks reached completely dried out. Temperature fluctuations and instabilities in the vapour and liquid lines were observed. Heat leakage from the evaporator and intermittent motion in the flow regime were significant factors in generating the implicit boiling instability. As the input power was increased, onset of pool boiling, nucleate boiling, as well as slug and bubbles were observed successively when the liquid level was above the surface of the wicks. When the net input power reached 236 W, the water film suddenly receded toward the wick surface. The process of the meniscus receding during the film evaporation, and the dynamics from the initial condition until dryout on the sintered copper wicks were observed and documented.
    Relation: Journal of Thermal Science and Technology 9(2), 14-00078(10pages)
    DOI: 10.1299/jtst.2014jtst0007
    Appears in Collections:[機械與機電工程學系暨研究所] 期刊論文

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