Analysis of Thermal Resistance Characteristics of Power LED Module

淡江大學機構典藏 > 工學院 > 機械與機電工程學系暨研究所 > 期刊論文 > Item 987654321/98394

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题名:	Analysis of Thermal Resistance Characteristics of Power LED Module
作者:	Wang, Chien-Ping;Kang, Shung-Wen;Lin, Kuan-Min;Chen, Tzung-Te;Fu, Han-Kuei;Chou, Pei-Ting
贡献者:	淡江大學機械與機電工程學系
关键词:	Junction temperature;LED module;thermal resistance
日期:	2014-01
上传时间:	2014-07-28 13:54:32 (UTC+8)
出版者:	New York: Institute of Electrical and Electronics Engineers
摘要:	Multichip LED arrays are widely used for lighting to provide high luminance. Luminous efficacy, lifetime, and color temperature are highly dependent on the temperature at p-n junction. This paper investigated the effects of distance, number of chips, and driving current on the thermal resistance of LED module. Thermal resistance dramatically increased as the distance between LED chips decreased due to significant thermal spreading impedance for heat dissipation from junction to ambient. The parallel-resistance formula substantially underestimated the junction temperature of the LED modules due to significant thermal crowding effect. Thermal boundary can also rise junction temperature as the distance to the board edge decreased in both the two-chip and four-chip modules. Infrared results showed that chip temperatures were highly consistent with thermal resistance measurements under different driving currents.
關聯:	IEEE Transactions on Electron Devices 61(1), pp.105-109
DOI:	10.1109/TED.2013.2291406
显示于类别:	[機械與機電工程學系暨研究所] 期刊論文

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