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    題名: Analysis of Thermal Resistance Characteristics of Power LED Module
    作者: Wang, Chien-Ping;Kang, Shung-Wen;Lin, Kuan-Min;Chen, Tzung-Te;Fu, Han-Kuei;Chou, Pei-Ting
    貢獻者: 淡江大學機械與機電工程學系
    關鍵詞: Junction temperature;LED module;thermal resistance
    日期: 2014-01
    上傳時間: 2014-07-28 13:54:32 (UTC+8)
    出版者: New York: Institute of Electrical and Electronics Engineers
    摘要: Multichip LED arrays are widely used for lighting to provide high luminance. Luminous efficacy, lifetime, and color temperature are highly dependent on the temperature at p-n junction. This paper investigated the effects of distance, number of chips, and driving current on the thermal resistance of LED module. Thermal resistance dramatically increased as the distance between LED chips decreased due to significant thermal spreading impedance for heat dissipation from junction to ambient. The parallel-resistance formula substantially underestimated the junction temperature of the LED modules due to significant thermal crowding effect. Thermal boundary can also rise junction temperature as the distance to the board edge decreased in both the two-chip and four-chip modules. Infrared results showed that chip temperatures were highly consistent with thermal resistance measurements under different driving currents.
    關聯: IEEE Transactions on Electron Devices 61(1), pp.105-109
    DOI: 10.1109/TED.2013.2291406
    顯示於類別:[機械與機電工程學系暨研究所] 期刊論文

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