本研究針對盲用點字顯示器點字方之點字機構可能產生之熱破壞進行分析。新型點字機構包含觸動及磁性機構兩部份。於生產組裝過錫製程中常發現磁性機構之線圈漆包線捻線與線圈座端腳接連處因溫度過高產生熱破壞。研究中針對此熱破壞分別探討滲錫深度、漆包線捻線股數及捻線與線圈座端腳連接之影響。研究採ANSYS有限元素法（FEM）軟體進行熱傳和熱應力影響模擬；先由線圈漆包線、捻線和端腳連接起始執行一維簡易熱傳、一維線型及三維線型FEM分析；進而嵌上不同的固定框架進行整體磁性機構的三維實體分析。分析結果顯示點字機構採五股捻線較佳，其溫度和應力皆可符合設計需求。 In this study, the heat failure of Braille mechanisms of a Brailledisplay cell is analyzed. A Braille mechanism contains a buntmechanism and a magnetic mechanism. Heat failures are often found inthe joint of the enameled-insulated twisted wire and the lead of thecoil in the magnetic mechanism while soldering. Thus, the influence ofpermeating depth of solder, columns of twisted enameled wire, andleads of a coil are studied. ANSYS, software based on the finiteelement method (FEM), is used for heat conduction and thermal stressanalysis. After the simplified and three-dimensional full model FEManalysis, it is found five columns of twisted enameled wire willfulfill the design requirements.
