The development of electronic components in the recent decades has been very fast. Computer chip is always accompanied by the increase of heat dissipation and miniaturization per unit area. Traditional heat sink or thermal module combines with fan are not enough to solve the heat dissipation problems. The research used several diffused channel and two-phase flow phenomenon in the valveless bubble pump device. The working fluid absorb the heat and reaches to saturated steams state, the liquid vaporized and the steam bubble took large heat transfer to condenser quickly. Because of the pressure drop, the steam bubble transferred toward one direction motions. Because this design without any moving parts in the diffused channel bubble pump, so it can solve friction problems of valves in a traditional pump. The testing used open loop design, and the work range of methanol is under 42 W/cm/sup 2/ and the die temperature is between 70 degree C and 90 degree C. In the vertical configuration, under 1 atmospheric pressure, the valveless bubble pump remain operate without dry out as heat flux increase to 42 W/cm/sup 2/, the minimum value for the total thermal resistance with methanol is 1.03 degree C/W, the lowest thermal resistance of evaporator is 0.35 W/degree C, and the thermal resistance of vapor line is 0.24 W/degree C.
Relation:
2007 CSME CONF中國機械工程學會第24屆全國學術研討會論文集=Proceedings of the 24th National Conference on Mechanical Engineering the Chinese Society of Mechanical Engineers，5頁
