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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/96480

    Title: 無閥多孔質熱傳泵性能初步研究
    Other Titles: Preliminary Study of Valveless Porous Medium Heat Pump
    Authors: 康尚文;蔡孟昌
    Contributors: 淡江大學機械與機電工程學系
    Keywords: 無閥泵浦;相變化;Valveless pump;Two phase flow
    Date: 2007-11
    Issue Date: 2014-03-07 11:47:31 (UTC+8)
    Abstract: Electrical chip is always accompanied by the increase of heat dissipation and miniaturization. Heat sink or thermal module combines with fan are not enough to solve the heat dissipation problems. A preliminary study of valveless porous heat pump used to be a heat transfer units were presented in this paper. The pump consists of two fluid flow rectifying diffuser/nozzle elements which are connected to the inlet and outlet of a pump chamber. This design could let the working fluid vaporized and took large heat transfer to condenser quickly from one direction. Because this design without any moving parts in the valveless porous heat pump, so it can solve friction problems of valves in a traditional pump. The testing used open loop design, and the work range of methanol is under 8 W/cm/sup 2/. The highest temperature occurs for the evaporator filled with methanol, for heat flux 8 W/cm/sup 2/ the die temperature is around 70 degree C. Because of the latent heat the ethanol present a large work range under 15 W/cm/sup 2/ and the die temperature is between 83 degree C and 93 degree C. In the vertical configuration, under 1 atmospheric pressure, the minimum value for the thermal resistance with methanol is 3.56 degree C/W and with ethanol is 3.56 degree C/W. The design of close loop valveless porous heat pump, effect of fluid fill ratio, effect of different channel angle, and effect of condenser type were studied.
    Relation: 2007 CSME CONF中國機械工程學會第24屆全國學術研討會論文集=Proceedings of the 24th National Conference on Mechanical Engineering the Chinese Society of Mechanical Engineers,4頁
    Appears in Collections:[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Proceeding

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