半導體產業是我國最具有全球競爭力的產業之一，隨著電子產品功能不斷增強，電子元件內部因高功率而產生的高溫現象，須有良好的散熱裝置加以冷卻。現有的散熱鰭片-風扇為主之散熱機制，勢必無法滿足未來微電子元件散熱需求，因此本研究提出以相變化為主之平板迴路式熱管研製來提高整體作動性能及散熱效率。平板熱管其特徵有蒸發區、汽相流道、空冷式散熱模組以及液相流道。本研究設計一個新穎的結構在熱管的蒸發區中，利用梳狀溝槽以及特殊的銅網結構層去產生一個高毛細推動力。本研究在銅結構的蒸發區之上接合玻璃作為上蓋，以便觀察內部流體之作動，實驗充填的流體有甲醇、水以及冷媒(HCFC 141b)。初步實驗結果顯示平板迴路熱管充填甲醇之時，可以溢散至少68瓦的熱量。在空冷的條件之下，整體熱阻可達到1.35℃/W，若加以較強力的冷凝器則可以有更佳的效果，平板迴路熱管應用於筆記型電腦中。為提升冷卻效能，平板熱管其熱傳極限、最佳充填率及尺寸設計之相關研究仍持續積極進行中。 IC industry is one of Taiwan industries gaining strong global competitiveness. With increasing functions of electrical manufactures, we need advanced cooling systems to solve the high temperature problems resulted from interior concentrative power consumption of electric device. The available fan-heat sink mechanism will be certainly not satisfying with the cooling requirement of prospective electric devices. So we bring up the study of Flat Plate Loop Heat Pipe (FPLHP) utilizing the phase change phenomenon to enhance cooling ability. In this study, FPLHP consisting of an evaporator, vapor line, air condenser, and liquid line was fabricated and characterized. Evaporator with comb grooves and copper mesh is a novel design to increase capillary pumping capacity. FPLHP were realized by bonding a glass onto copper substrate, resulting in a transparent cover for observation. Methanol, Water, and Freon (HCFC 141b) were used as the working fluid in the experiment. Preliminary result showed that FPLHP filled with methanol could dissipate heat more than 68W. Under air cooling the total thermal resistance of such a system is 1.3 .degree./W and depends strongly on the cooling conditions and the radiator efficiency. Research work is continuing for the heat transfer limitation, different fluid charge rate and optimization of the FPLHP size design in an effort to improve the cooling performance of the notebook computer.
