以空氣電漿及反應離子蝕刻製作鑽石微結構之研究

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Title:	以空氣電漿及反應離子蝕刻製作鑽石微結構之研究
Other Titles:	Investigation of Fabricating Micro/Nano-Structures on CVD Diamond Film by Atmospheric Pressure Air Plasma and Reactive Ion Etching
Authors:	陳泰全;林夏蓁;趙崇禮;周文成;馬廣仁
Contributors:	淡江大學機械與機電工程學系
Keywords:	CVD鑽石膜;反應離子蝕刻;空氣電漿;微結構;CVD diamond grain;RIE;Atmospheric pressure air plasma;Microstructure
Date:	2007-11
Issue Date:	2014-03-07 11:44:27 (UTC+8)
Abstract:	鑽石具有極佳的物理特性與化學特性如:高硬度、低摩擦係數、高熱傳導係數、良好的機械強度、高光學穿透性。這些特性具有潛力應用於電子元件、光學元件及抗腐蝕鍍膜上。近年來以化學氣相沉基法製作多晶鑽石膜已成為成熟且廣泛的合成技術。本篇研究不只說明使用常壓空氣電漿(APAP)及反應離子蝕刻(RIE)製作鑽石微結構之機制，並且將鑽石微結構應用在熱化學拋光及奈米壓印上。本論文分別以掃描式電子顯微鏡(Scanning electron microscope)、拉曼頻譜儀(micro-Raman spectroscopy)、表面粗度儀(alpha-step)來檢測表面形貌及分析組成物。藉由分析結果發現微結構可成功結合熱化學拋光上，並且微結構具有應用於奈米壓印之潛力。 Diamond has many outstanding physical and chemical properties such as extreme hardness, low friction coefficient, high thermal conductivity, high mechanical strength, and high optical transparency. Therefore, several potential applications can be anticipated in electronics, optics, protective corrosion resistant coatings. In recent years, using chemical vapor deposition (CVD) methods to synthesize polycrystalline diamond is a mature and popular technology. This study not only indicated the producing mechanism of these microstructures on CVD diamond grains by atmospheric pressure air plasma (APAP) and reactive ion etching, but also used these microstructures applying to the thermal-chemical polishing and nano-imprint process. Scanning electron microscope, micro-Raman spectroscopy and alpha-step were used to study the surface morphology and component analysis, respectively. From the results showed that the microstructures could be successfully combined the thermal-chemical polishing method and these microstructures had a potential to apply in nano-imprint process.
Relation:	2007 CSME CONF中國機械工程學會第24屆全國學術研討會論文集=Proceedings of the 24th National Conference on Mechanical Engineering the Chinese Society of Mechanical Engineers，6頁
Appears in Collections:	[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Proceeding

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