Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining

機構典藏 > College of Engineering > Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering > Proceeding > Item 987654321/96349

Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/96349

Title:	Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining
Authors:	Yang, Lung-Jieh;Chen, Ming-Cheng;Chang, Chin-Jung
Contributors:	淡江大學機械與機電工程學系
Keywords:	微壓力感測器;微加工;矽晶圓;壓電阻率;Micro Pressure Sensor;Micromaching;Silicon Wafer;Piezoresistivity
Date:	1999-11
Issue Date:	2014-03-07 11:20:35 (UTC+8)
Abstract:	This paper proposed a new direction for the miniaturization of silicon bulk-machined sensors. Herein, the glass substrate bonded with the silicon wafer replaces the role of the silicon wafer. Then the whole silicon wafer with sensing portions, whatever piezo-resistive or capacitive types, could be all machined to the membrane structure without chip-area wasting on the {111} surfaces. Basically, the chip size by this semi-SOI method would be as small as the surface-machined one in principle, if the silicon-glass bonding process is guaranteed. The other advantages of this strategy include the process compatibility with the different sensing principles and the different techniques of membrane machining. The on-chip circuitry of sensors could be also preserved. Another important issue is that the surface-machining-like membrane now is mono-crystalline, which means the stable mechanical properties and reproducible characteristics. This new strategy practically augmented the mass production of piezoresistive pressure sensors. The 1.0mm X 0.8mm X 0.5mm of sensor size with chip density exceeds 5,000 per 4-inch wafer was successfully fabricated.
Relation:	1999年中華民國電子材料與元件研討會論文集，頁581-584
Appears in Collections:	[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Proceeding

Files in This Item:

File	Size	Format
Micro Pressure Sensor with Sub-MM Size by the Silicon Bulk Micromachining _英文摘要.docx	14Kb	Microsoft Word	170	View/Open

Loading...