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    請使用永久網址來引用或連結此文件: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/96349

    題名: Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining
    作者: Yang, Lung-Jieh;Chen, Ming-Cheng;Chang, Chin-Jung
    貢獻者: 淡江大學機械與機電工程學系
    關鍵詞: 微壓力感測器;微加工;矽晶圓;壓電阻率;Micro Pressure Sensor;Micromaching;Silicon Wafer;Piezoresistivity
    日期: 1999-11
    上傳時間: 2014-03-07 11:20:35 (UTC+8)
    摘要: This paper proposed a new direction for the miniaturization of silicon bulk-machined sensors. Herein, the glass substrate bonded with the silicon wafer replaces the role of the silicon wafer. Then the whole silicon wafer with sensing portions, whatever piezo-resistive or capacitive types, could be all machined to the membrane structure without chip-area wasting on the {111} surfaces. Basically, the chip size by this semi-SOI method would be as small as the surface-machined one in principle, if the silicon-glass bonding process is guaranteed. The other advantages of this strategy include the process compatibility with the different sensing principles and the different techniques of membrane machining. The on-chip circuitry of sensors could be also preserved. Another important issue is that the surface-machining-like membrane now is mono-crystalline, which means the stable mechanical properties and reproducible characteristics. This new strategy practically augmented the mass production of piezoresistive pressure sensors. The 1.0mm X 0.8mm X 0.5mm of sensor size with chip density exceeds 5,000 per 4-inch wafer was successfully fabricated.
    關聯: 1999年中華民國電子材料與元件研討會論文集,頁581-584
    顯示於類別:[機械與機電工程學系暨研究所] 會議論文


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