English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 62797/95867 (66%)
造访人次 : 3737214      在线人数 : 373
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/96172


    题名: Dynamic fracture analysis of an interfacial crack in a two-layered functionally graded piezoelectric strip
    作者: Ing, Y.S.;Chen, J.H.
    贡献者: 淡江大學航太工程學系
    关键词: Functionally graded piezoelectric material;Stress intensity factor;Energy density factor;Permeable crack;Durbin method
    日期: 2013-02
    上传时间: 2014-03-05 14:29:28 (UTC+8)
    出版者: Amsterdam: Elsevier BV
    摘要: The transient response of an interfacial crack between two functionally graded piezoelectric strips was investigated. The layered functionally graded piezoelectric material (FGPM) was subjected to uniform anti-plane mechanical and in-plane electric displacement impacts on the upper and lower free surfaces. An integral transform, Cauchy singular integral equation, and Chebyshev polynomial expansions were applied to obtain stress intensity factors and energy density factors in the Laplace transform domain. The Durbin method was then used to implement numerical inversion. The accuracy of the numerical results was examined, and superior parameters for Durbin inversion were suggested. The results show that the functionally graded parameters of the two-layered FGPM can either increase or decrease the value of the dynamic stress intensity factor and the dynamic energy density factor, thereby retarding or promoting the propagation of interfacial cracks.
    關聯: Theoretical and Applied Fracture Mechanics 63-64, pp.40-49
    DOI: 10.1016/j.tafmec.2013.03.004
    显示于类别:[航空太空工程學系暨研究所] 期刊論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    0167-8442_63-64p40-49.pdf3031KbAdobe PDF119检视/开启
    index.html0KbHTML287检视/开启

    在機構典藏中所有的数据项都受到原著作权保护.

    TAIR相关文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回馈