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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/94912


    Title: 以Sol-Gel法製成有機-無機混成材料
    Authors: 陳幹男;李元智
    Contributors: 淡江大學化學工程學系
    Keywords: 環氧樹脂丙烯酸酯;溶膠-凝膠法;四乙氧基矽烷;硬度;Epoxy Acrylate;Sol-Gel Method;Tetraethoxysilane;Hardness
    Date: 2001-01
    Issue Date: 2014-02-09 00:41:09 (UTC+8)
    Abstract: 在本實驗中,由於可紫外光交聯硬化之Epoxy acrylate具有反應性之OH基,在Sn觸媒下(T-12)可與TEOS產生脫醇反應,因此產生Si-O-C得鍵結,在經由SOL-GEL法製備成有機-無機混成材料可產生良好之混成效果,經由SEM可觀察出SiO/sub 2/、粒徑大小10-20nm,可證實為奈米級複合材料,另外由TGA可證實SiO/sub 2/隨著TEOS增加而增加,薄膜硬度也隨之增加。
    In this experiment, because of the UV-curable epoxy acrylate resinhave reactive OH group, it can be reacted under the Sn catalyst. Thenit can form the Si-O-C chemical bond, so it have good hybride effectby sol-gel process. They can be identified by SEM to mesure thepartical size. Their silica containe can increase by more TEOSconcentration, determined by TGA, and their silica can improve thethin film hardness.
    Relation: 第二十四屆高分子研討會論文專輯2001=Proceediings of the 24th ROC Polymer Symposium 2001
    Appears in Collections:[化學工程與材料工程學系暨研究所] 會議論文

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