|摘要: ||發光二極體(Lighting Emitting Diode; LED)具有耗電量小、使用壽命長、更加環保、顏色豐富以及高亮度之優勢，在近年來有逐步取代傳統光源之趨勢，並廣泛應用在發光面板上，但是其仍然有散熱方面的問題，為此，探討LED之散熱研究為目前最重要的課題之一。本實驗使用T3Ster熱性能量測系統，建立LED溫度敏感係數(Temperature Sensitive Parameter; TSP)曲線並使用其後處理程式T3SterMaster做結構方程式轉換得知LED構裝之熱阻比熱容圖，介而推估每一層熱阻大小。|
本論文使用元件大小為1.4cm×1.4cm，厚度0.2cm，單顆晶粒大小為0.12cm×0.12cm×0.015cm，欲研究探討LED多晶模組(2 Chips LED與4 Chips LED)分別以操作電流100mA、350mA、500mA、700mA在不同間隔距離(0.25cm、0.45cm、0.74cm、1.02cm)以及晶粒串並聯方式之情況下，其之熱性能表現。
其結果顯示，串並聯之連接在2 Chips LED與4 Chips LED實驗中，其接點溫度間只有些微的差異；而在操作電流越大時，熱阻也相對越大，但是隨著晶粒間距離的增加，熱阻則不完全會隨之減少；考量LED多晶模組之熱性能優化時需要考量到晶粒間的距離以及模組幾何尺寸的相互影響。
Lighting Emitting Diode (LED), which has various advantages, such as less power consumption, long lifespan, green environment, variegated colors, high brightness. In these days LED not only has replaced traditional light sources step by step but also has widespread used at lighting plates. But it also has some weakness like heat dissipation. Therefore, thermal management of LEDs modules is one of the most important issues. In this study, using T3Ster measurement system, Temperature Sensitive Parameter (TSP) curves of the LEDs modules were attained then transform transient data to cumulative structure function graphics by the T3SterMaster software.
A series of 2 chips LED and 4 chips LED with 0.25cm, 0.45cm, 0.74cm, 1.02cm four different distances have been packaged in an 1.4cm x 1.4cm x 0.2cm aluminum plate and tested their thermal resistance. The dimension of the single In-GaN blue LED chip is 0.12cm x 0.12cm x 0.015cm. To investigate influence of the electricity on the LEDs modules, tests were conducted under parallel and series circuit respectively, with 100mA, 350mA, 500mA, and 700mA four different control currents.
It was shown that a slight variation of junction temperature between parallel and series circuit tests. Increasing the control current will increase the thermal resistance of LEDs modules. In addition to chip distance, result also showed that size of aluminum plate and boundary condition might have consequences for thermal resistance.