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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/93283


    Title: Preparation and properties of dual-curable epoxyacrylate composites filled with different functionalized silica spheres
    Authors: Su, Yu-Chieh;Don, Trong-Ming
    Contributors: 淡江大學化學工程與材料工程學系
    Keywords: silica spheres;epoxyacrylate;fracture toughness;mechanical properties
    Date: 2013-07-15
    Issue Date: 2013-12-16 09:14:37 (UTC+8)
    Abstract: In this study, uniform-sized silica spheres were first synthesized by sol-gel reaction under a basic environment and their surfaces were modified to possess different functional groups including vinyl, epoxide and amino groups by reaction with 3-methacryloxypropyl trimethoxy silane (MPTMS), vinyl triethoxysilane (VTEOS), 3-glycidoxy propyltrimethoxy silane (GPTMS) and 3-Aminopropyl trimethoxysilane (APTMS). The functionalized silica spheres were characterized by FTIR, 29Si and 13C solid-NMR and SEM. These silica spheres with size ranging from 150~250 nm were then added to the pre-synthesized difunctional epoxyacrylate resin with one epoxide end group and one vinyl terminal groups. After photo- and thermal cure, mechanical properties and fracture toughness were measured to elaborate the effects of different functionalized silica spheres on the properties of epoxyacrylate-silica composites. Tensile mechanical properties including initial modulus, ultimate tensile strength and elongation at break, and also the fracture toughness of the epoxyacrylate-silica composite were all increased with increasing the amount of modified silica spheres. The increase of fracture toughness was due to the crack deflection and particle-matrix debonding as evidenced by SEM pictures on the fracture surface. Among these composites, the one filled with the MPTMS-modified silica had the best tensile mechanical properties and fracture toughness.
    Relation: Proceedings of the Polymer Processing Society 29th Annual Meeting, pp.93
    Appears in Collections:[化學工程與材料工程學系暨研究所] 會議論文

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