淡江大學機構典藏:Item 987654321/92077
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    题名: Effect of weak reductant on properties of electroless copper polyacrylonitrile nanocomposites for electromagnetic interference shielding
    作者: Tsao, Keng-Yu;Chen, Chang-Cheng;Huang, Chi-Yuan;Tsai, Ching-Shan;Yang, Sung-Yeng;Yeh, Jen-Taut;Chen , Kan-Nan
    贡献者: 淡江大學化學學系
    关键词: EMI;electroless;CuS;polyacrylonitrile
    日期: 2010-05-27
    上传时间: 2013-08-13 14:53:53 (UTC+8)
    出版者: Hoboken: John Wiley & Sons, Inc.
    摘要: In this work, the electroless copper method with different reductant compositions (NaHSO3/Na2 S2O3·5H2O and Na2S2O3·5H2O) without sensitizing and activating, was used to deposit copper-sulfide deposition on the polyacrylonitrile (PAN) surface for electromagnetic interference (EMI) shielding materials. The weak reductant, NaHSO3, in the electroless copper method was used to control the phase of copper-sulfide deposition. The Cux(x=1–1.8)S was deposited on the PAN (CuxS-PAN) by reductant composition (NaHSO3/Na2S2O3·5H2O) and the Cux(x=1–1.8)S deposition of CuxS-PAN possesses three kinds of copper-sulfide phases (CuS, Cu1.75S and Cu1.8S). However, the electroless copper with reductant was only Na2S2O3·5H2O (without weak reductant, NaHSO3), the hexagonal CuS deposition was plated on the PAN (CuS-PAN) and increased the EMI shielding effectiveness of CuS-PAN composites about 10–15 dB. In this study, the best EMI SE of CuS-PAN and CuxS-PAN composites were about 27–30 dB and 15–17 dB respectively, as the cupric ion concentration was 0.24 M. The volume resistivity of CuS-PAN composite was about 1000 times lower than that of CuxS-PAN composite and lowest volume resistivity of CuS-PAN composites was 0.012 Ω cm, as the cupric ion concentration was 0.24 M.
    關聯: Journal of Applied Polymer Science 118(2), pp. 936-942
    DOI: 10.1002/app.32467
    显示于类别:[化學學系暨研究所] 期刊論文

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