淡江大學機構典藏:Item 987654321/89051
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 62822/95882 (66%)
Visitors : 4026917      Online Users : 897
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
    •  Adv. Search
    Home ‧ Login ‧ Upload ‧ Help ‧ About ‧ Administer Goto mobile version


    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/89051


    Title: Effect of curing temperature on properties and solvent welding strength of ovalbumin
    Authors: Lin, Ching-bin
    Contributors: 淡江大學機械與機電工程學系
    Keywords: ovalbumin;crosslinking;curing;tensile;joint strength;solvent welding
    Date: 2011-10-26
    Issue Date: 2013-05-08 11:44:45 (UTC+8)
    Publisher: Hoboken: John Wiley & Sons, Inc.
    Abstract: Effect of curing temperature on properties of ovalbumin has been investigated. Functional basis, crosslinking degree, tensile strength, and hardness increases with rising curing temperature. The increase of visible transmittance and the decrease of absorption accompany with increasing wavelength. The absorptive peak shows at 440–450 nm and the wavelength of the absorptive peak increases with the rising curing temperature. The relationship of joint strength with solvent welded joints of ovalbumin to their microstructure is also investigated. Ovalbumin can promote joint strength after the treatment of distilled water and curing. Comparing joint strength with fracture morphology, the smoother fracture surface morphology is related to the maximum tensile and shear joint strength, respectively. The joint strength is increasing with curing temperature and compressive stress, and the joint strength of treatment with 150°C curing temperature and 0.12 kgf/mm2 compressive stresses are larger than its original tensile fracture strength of cured ovalbumin at same curing temperature.
    Relation: Journal of Applied Polymer Science 124(3),　p.2144–2153
    DOI: 10.1002/app.35311
    Appears in Collections:[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Journal Article

    Files in This Item:

    File Description SizeFormat
    index.html0KbHTML271View/Open
    Lin_et_al-2012-Journal_of_Applied_Polymer_Science.pdf1971KbAdobe PDF1View/Open

    All items in 機構典藏 are protected by copyright, with all rights reserved.

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback