含銅粒子床之洗滌

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Title:	含銅粒子床之洗滌
Other Titles:	Novel Washing Characteristics of Copper-Containing Clay Sludge Cake
Authors:	許顧耀;吳容銘;李篤中
Contributors:	淡江大學化學工程與材料工程學系
Keywords:	濾餅洗滌;銅離子;沈澱;電荷中和;黏土;後處理;Cake Washing;Copper Ion;Precipitation;Charge Neutralization;Clay;Post Treatment
Date:	1996-11-30
Issue Date:	2013-04-13 21:00:04 (UTC+8)
Abstract:	銅在低pH值下以離子狀態存在,因此其於黏土濾餅中之洗滌相對而言十分容易;於高pH值下將產生不定形氫氧化銅沈澱並會吸附於黏土表面,其行為類似於沈澱-電性中和模型(Dentel,1991)。本文探討含銅粒子床之洗滌操作,並提出一包含沈澱物溶解之洗滌模式。
Relation:	Proceedings 1996 Symposium on Transport Phenomena and Applications
Appears in Collections:	[Graduate Institute & Department of Chemical and Materials Engineering] Proceeding

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