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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/88218

    Title: 含銅粒子床之洗滌
    Other Titles: Novel Washing Characteristics of Copper-Containing Clay Sludge Cake
    Authors: 許顧耀;吳容銘;李篤中
    Contributors: 淡江大學化學工程與材料工程學系
    Keywords: 濾餅洗滌;銅離子;沈澱;電荷中和;黏土;後處理;Cake Washing;Copper Ion;Precipitation;Charge Neutralization;Clay;Post Treatment
    Date: 1996-11-30
    Issue Date: 2013-04-13 21:00:04 (UTC+8)
    Abstract: 銅在低pH值下以離子狀態存在,因此其於黏土濾餅中之洗滌相對而言十分容易;於高pH值下將產生不定形氫氧化銅沈澱並會吸附於黏土表面,其行為類似於沈澱-電性中和模型(Dentel,1991)。本文探討含銅粒子床之洗滌操作,並提出一包含沈澱物溶解之洗滌模式。
    Relation: Proceedings 1996 Symposium on Transport Phenomena and Applications
    Appears in Collections:[化學工程與材料工程學系暨研究所] 會議論文

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