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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/88035

    Title: 蒸汽腔體均溫性之數值模擬
    Other Titles: Temperature uniformity simulation of vapor chamber heat spreader
    Authors: 林駿穎;Lin, Jun-Ying
    Contributors: 淡江大學機械與機電工程學系碩士班
    Keywords: 蒸汽腔體;Temperature Uniformity;升溫速率;均溫性;Vapor chamber;heating rate
    Date: 2012
    Issue Date: 2013-04-13 11:57:47 (UTC+8)
    Abstract: 本文採用數值模擬之方式,假設處於自然對流流場之情況下,使用CFD模擬軟體,針對不同材質均溫板之均溫性與升溫速率進行模擬分析。
    In this study, temperature uniformity and heating rate of heat spreaders with multi-well are simulated and analyzed by CFD software under natural convection condition. Temperatures on a series of different heat spreaders are simulated and compared at a heating power of 1200W. Six 200W heat sources with an area of 30×30mm are applied evenly to spreader. Multi-well heat spreader (112×75×17.2mm) is composed of a 4mm thick heat spreader, and a 13.2mm thick upper plate with 173 wells (diameter of the wells is 5mm and depth is 10mm). We selected four materials for the heat spreader, including copper, aluminum, silver, and vapor chamber. Temperature uniformity is evaluated by the temperature difference and the standard deviation. Vapor chamber heat spreader has the better temperature uniformity due to a higher thermal conductivity, followed by silver, copper and aluminum heat spreader. Aluminum and silver heat spreader show the higher heating rate, followed by copper heat spreader, vapor chamber heat spreader due to a larger heat capacity, heat up the slowest.
    Appears in Collections:[機械與機電工程學系暨研究所] 學位論文

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