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    Title: 磨粒流噴射加工脆性材料之研究
    Other Titles: Investigation of awj(abrasive-water-jet) machining of brittle materials
    Authors: 紀厚任;Chi, Hou-Jen
    Contributors: 淡江大學機械與機電工程學系碩士班
    趙崇禮;Chao, Choung-Lii
    Keywords: 磨料噴射加工;化學剛化玻璃;碳化鎢;雷射搭配磨料噴射之混合切割法;Abrasive-Water-Jet(AWJ);Chemically Toughened Cover Glasses;WC;Novel Laser/AWJ Hybrid Dicing Process
    Date: 2012
    Issue Date: 2013-04-13 11:57:18 (UTC+8)
    Abstract: 磨粒流噴射能有效的加工鋼、鈦合金、複合材料和陶瓷材料等難加工的材料。在高加工角度(90到45度)的磨料噴射加工中,所應用的領域有切割、劃線及鑽孔。另外運用在微切削、拋光和清除上,則是利用到小加工角度(0到45度)的磨料噴射。本研究的主旨在探討利用磨料噴射切割化學剛化玻璃以及精密研磨拋光碳化鎢材的可行性。本論文利用各種粒徑的氧化鋁粉及碳化矽粉做為加工磨料,台灣康寧顯示玻璃股份有限公司所提供的化學剛化玻璃及不同鈷含量之碳化鎢則為加工試驗材料。研究結果顯示,由於碳化鎢及鈷的移除速率不同,鈷含量高(18%)比鈷含量低(0到3%)之精密研磨碳化鎢材,較難改善其表面粗糙度。由於碳化矽磨料有較高的硬度值,可以比氧化鋁磨料得到更好的材料移除率。至於磨料噴射切割的過程中,本論文提出了一種新的雷射搭配磨料噴射之混合切割法,此加工法是利用雷射穿透剛化玻璃的剛化層以及利用磨料噴射完成剩餘的切割加工,本研究驗證了此加工法的可行性。
    Water abrasive jet (WAJ) is regarded as one of the very effective ways of machining difficult-to-machine materials such as steel, titanium alloys, composite and ceramic materials. Its applications can range from cutting/dicing/drilling when applying the AWJ with a high impact angle to micro-cutting/polishing/cleaning where the impact angle is kept very low. This research aimed to study the feasibility of using AWJ to cut the chemically toughened cover glasses and to polish the precision ground tungsten carbide (WC) materials. Alumina (Al2O3) and silicon carbide (SiC) particles of various sizes were used as the abrasives. Chemically toughened Gorilla (Corning) glass and WC of different cobalt concentrations were the tested materials. It is founded that, owing to the different removal rate between Co and WC, surface roughness of precision ground WC specimen of high Co concentration (18%) is more difficult to be improved than those of lower Co concentration (0~3%). SiC abrasives, having the higher hardness value, can achieve better material removal than Al2O3. As to the AWJ dicing process, a novel laser/AWJ hybrid dicing process where using laser to penetrate the toughened layer and AWJ to finish the dicing process was proposed and verified in this study.
    Appears in Collections:[機械與機電工程學系暨研究所] 學位論文

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