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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/88013

    Title: 微加工用小尺寸鑽石砂輪之研製
    Other Titles: Study on fabrication of small diamond wheels for micro-grinding applications
    Authors: 邱柏翔;Chiu, Po-Hsianf
    Contributors: 淡江大學機械與機電工程學系碩士班
    趙崇禮;Chao, Choung-Lii
    Keywords: 玻璃模造;磨削加工;碳化鎢;UV固化樹脂;洋蔥式Curing;GMP;grinding;tungsten carbide;UV curing resin;onion-type curing
    Date: 2012
    Issue Date: 2013-04-13 11:56:44 (UTC+8)
    Abstract: 由於光電產業的蓬勃發展,各種精密的光學元件趨於輕薄短小,各界紛紛開發新的加工技術,及改善現有的方法,並有效率的生產相關的組件。在近幾年中,玻璃模造是生產精密光學元件的方法之一,而模具的加工是玻璃模造技術的關鍵要素,通常模具使用硬脆材料製造而成,如碳化鎢(WC)和碳化矽(SiC)等,而模具的加工方式主要以精密鑽石磨削為主。由於光學元件的尺寸變小,因此微磨削加工所使用的工具也勢必得微小化,這將造成工具之取得不易,不但耗時且成本很高。
    As the demand for precision optical components with sub-millimeter feature size steadily increasing, numerous efforts have been made in developing new techniques and in improving the existing approaches to efficiently and economically produce those components. Glass molding process (GMP) is one of these methods to enable mass production of precision glass optical components in recent years. One of the key issues in GMP is precision mold fabrication. Since the mold are normally made of hard and brittle materials such as tungsten carbide (WC) and silicon carbide (SiC), precision diamond grinding is by far the leading choice used to machine the GMP mold. As the feature size of optical component gets smaller, the size of mold and grinding wheel used to fabricate the mold gets smaller too. This makes getting one of those “micro diamond wheel” a time consuming and very expensive task.
    This research aimed to develop a effective way of fabricating small diamond wheel. UV curing polymers were used as bond materials for diamond particles of various sizes. Diamond wheels of around 0.8~1mm in diameter after truing were successfully produced. A surface roughness of 32nm Ra was achieved during preliminary diamond grinding tests of WC materials using the fabricated diamond wheel.
    Appears in Collections:[機械與機電工程學系暨研究所] 學位論文

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