淡江大學機構典藏:Item 987654321/79030
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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/79030


    Title: 蒸汽腔體均溫性之數值模擬
    Authors: 康尚文;林駿穎;黃俊賢;陳育堂
    Contributors: 淡江大學機械與機電工程學系
    Keywords: 均溫板;均溫性;升溫速率;蒸汽腔體
    Date: 2012-09
    Issue Date: 2012-11-21 16:28:27 (UTC+8)
    Abstract: 本研究利用計算流體力學CFD軟體,在自然對流的條件下,針對一系列不同材質之多孔均溫板進行均溫性與升溫速率之模擬分析。使用總加熱功率1200W之熱源,平均分佈在六個面積為30×30mm2之矩形板進行升溫。均溫板模型尺寸為112×75×17.2mm,其結構可區分為上板與下板。上板厚度為13.2mm,且含有173個直徑為5mm、深10mm的孔洞結構,下板部分則是厚度為4mm之矩形板。均溫板設定之主要材質有銅、銀、鋁、蒸汽腔體等四種。評斷均溫性的優劣多採用均溫板之最大溫差值進行比較。根據模擬結果顯示,蒸汽腔體因具有較高之熱含量,其升溫速率較為緩慢;而蒸汽腔體的熱傳導係數較大,均溫性之表現較其他材質要佳。因此未來在選用均溫板時,使用蒸汽腔體作為一均溫導熱之媒介,將會是比較佳的選擇。
    Appears in Collections:[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Proceeding

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