Temperature Uniformity Simulation of Vapor Chamber

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题名:	Temperature Uniformity Simulation of Vapor Chamber
作者:	Kang, Shung-wen;Lin, Jun-ying;Huang, Chun-hsien;Chen, Yu-tang
贡献者:	淡江大學機械與機電工程學系
关键词:	vapor chamber;temperature uniformity;heating rate
日期:	2012-10
上传时间:	2012-11-21 16:16:22 (UTC+8)
摘要:	In this study, temperature uniformity and heating rate of multi-well vapor chambers of different materials were simulated and analyzed by CFD software at natural convection condition. Heat sources with a total heating power of 1200W were uniformly distributed to six 30×30mm2 rectangular vapor chambers for heating. Model size of the vapor chamber is 112×75×17.2mm, and its structure is consisted of upper plate and lower plate. The upper plate is 13.2mm thick, and has 173 holes with a diameter of 5mm and a depth of 10mm for each. The lower plate is rectangular with a thickness of 4mm. The vapor chambers are made of four main materials: copper, silver, aluminum and vapor chambers. Temperature uniformity is assessed by comparing highest temperature differences of vapor chambers. The simulation results showed that the vapor chamber has better temperature uniformity than other materials because it has higher heat content, slower heating rate and higher coefficient of heat conduction. Thus, vapor chambers are a better choice in selection of vapor chambers.
關聯:	IMPACT Conference 2012
显示于类别:	[機械與機電工程學系暨研究所] 會議論文

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