English  |  正體中文  |  简体中文  |  Items with full text/Total items : 61685/94634 (65%)
Visitors : 1632785      Online Users : 19
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/79028

    Title: Temperature Uniformity Simulation of Vapor Chamber
    Authors: Kang, Shung-wen;Lin, Jun-ying;Huang, Chun-hsien;Chen, Yu-tang
    Contributors: 淡江大學機械與機電工程學系
    Keywords: vapor chamber;temperature uniformity;heating rate
    Date: 2012-10
    Issue Date: 2012-11-21 16:16:22 (UTC+8)
    Abstract: In this study, temperature uniformity and heating rate of multi-well vapor chambers of different materials were simulated and analyzed by CFD software at natural convection condition. Heat sources with a total heating power of 1200W were uniformly distributed to six 30×30mm2 rectangular vapor chambers for heating. Model size of the vapor chamber is 112×75×17.2mm, and its structure is consisted of upper plate and lower plate. The upper plate is 13.2mm thick, and has 173 holes with a diameter of 5mm and a depth of 10mm for each. The lower plate is rectangular with a thickness of 4mm. The vapor chambers are made of four main materials: copper, silver, aluminum and vapor chambers. Temperature uniformity is assessed by comparing highest temperature differences of vapor chambers. The simulation results showed that the vapor chamber has better temperature uniformity than other materials because it has higher heat content, slower heating rate and higher coefficient of heat conduction. Thus, vapor chambers are a better choice in selection of vapor chambers.
    Relation: IMPACT Conference 2012
    Appears in Collections:[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Proceeding

    Files in This Item:

    File Description SizeFormat

    All items in 機構典藏 are protected by copyright, with all rights reserved.

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback