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    题名: Fabricating a Heat Pipe Structure within a Radiating Plate for Electronics Fan-Less Cooling
    作者: Yu, Chun-sheng;Kang, Shung-wen;Chan, Hong-bin
    贡献者: 淡江大學機械與機電工程學系
    关键词: Fan-less;Heat pipe;Radiating plate
    日期: 2010-06
    上传时间: 2012-11-21 15:14:11 (UTC+8)
    出版者: Keelung, Taiwan : National Taiwan Ocean University
    摘要: This study presents a method for fabricating a conductive metal with a heat pipe structure integrally formed within a radiating plate, and the heat transfer channels are arranged in an orthogonal matrix. The developed heat transfer device is monolithic and seamless, thus achieving low heat resistance and high heat transfer efficiency. The high conductivity radiating plate discussed in this study has significantly improved structural strength and a complete hot spot contact for efficient cooling. Heat generated from a heat source is transferring without passing through different interfaces of materials or any solder paste within the high conductivity plate. The proposed heat transfer device is suitable for mounting in various heat transfer systems or heat dissipating modules. Therefore, electronic system cooling using a fan-less design will have potential improved heat transfer efficiency of about 33% by natural convection.
    關聯: Journal of Marine Science and Technology 18(3), pp.419-423
    DOI: 10.6119/JMST
    显示于类别:[機械與機電工程學系暨研究所] 期刊論文

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