Effect of silver nano-fluid on pulsating heat pipe thermal performance

doi:10.1016/j.applthermaleng.2007.10.019

機構典藏 > College of Engineering > Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering > Journal Article > Item 987654321/79022

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Title:	Effect of silver nano-fluid on pulsating heat pipe thermal performance
Authors:	Lin, Yu-hsing;Kang, Shung-wen;Chen, Hui-lun
Contributors:	淡江大學機械與機電工程學系
Keywords:	Concentration;Filled ratio;Pulsating heat pipes;Silver nano-fluid
Date:	2008-08
Issue Date:	2012-11-21 14:54:22 (UTC+8)
Publisher:	Kidlington: Pergamon
Abstract:	This paper presents preliminary experimental results on using copper tube having internal and external diameter with 2.4 mm and 3 mm, respectively, to carry out the experimental pulsating heat pipe. The working fluids include the silver nano-fluid water solution and pure water. In order to study and measure the efficiency, we compare with 20 nm silver nano-fluid at different concentration (100 ppm and 450 ppm) and various filled ratio (20%, 40%, 60%, 80%, respectively), also applying with different heating power (5 W, 15 W, 25 W, 35 W, 45 W, 55 W, 65 W, 75 W, 85 W, respectively). According to the experimental result in the midterm value (i.e. 40%, 60%) of filled ratio shows better. In the majority 60% of efficiency is considered much better. The heat dissipation effect is analogous in sensible heat exchange, 60% has more liquid slugs that will turn and carry more sensible heat, so in 60% of filled ratio, heat dissipation result is better than 40%, and the best filled fluid is 100 ppm in silver nano-fluid. Finally, we observed through the measurement comparison in thermal performance with pure water. When the heating power is 85 W, the average temperature difference and the thermal resistance of evaporator and condenser are decreased by 7.79 °C and 0.092 °C/W, respectively.
Relation:	Applied Thermal Engineering 28(11-12), pp.1312–1317
DOI:	10.1016/j.applthermaleng.2007.10.019
Appears in Collections:	[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Journal Article

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