English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 57980/91504 (63%)
造访人次 : 13700710      在线人数 : 45
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻

    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/76994

    题名: Electroless deposition of the copper sulfide coating on polyacrylonitrile with a chelating agent of triethanolamine and its EMI Shielding Effectiveness
    作者: Chen, Yen-hung;Huang, Chi-yuan;Lai, Fu-der;Roan, Ming-lih;Chen, Kan-nan;Yeh, Jen-taut
    贡献者: 淡江大學化學學系
    关键词: EMI SE;Electroless plating;Copper sulfide;TEA;Anchoring effect
    日期: 2009-07
    上传时间: 2012-05-23 15:46:20 (UTC+8)
    出版者: Lausanne: Elsevier S.A.
    摘要: In this study, an effective deposition of CuS on PAN film was proposed by an electroless plating method with the reduction agents NaHSO3 and Na2S2O3·5H2O and a chelating agent (triethanolamine, TEA). A variety of concentrations of TEA were added to obtain the anchoring effect and chelating effect in the electroless plating bath. The GIA-XRD and laser Raman analysis indicated that the deposited layer consisted of CuS. The mechanism of the copper sulfide (CuS) growth and the electromagnetic interference shielding effectiveness (EMI SE) of the composite were studied. It was found that the vinyl acetate remained in PAN substrate would be purged due to the swelling effect by TEA solution. Then the anchoring effect occurred due to the hydrogen bonding between the pits of PAN substrate and TEA. Consequently, the copper sulfide layer was deposited effectively by the electroless plating reaction. The swelling degree (Sd) was proposed and evaluated from the FT-IR spectra. The relationship between swelling degree of the PAN composite and TEA concentration (C) is expressed as: Sd = 0.07 + 1.00 × e^(− 15.15C). On the other hand, the FESEM micrograph showed that the average thickness of copper sulfide increased from 76 nm to 247 nm when the concentration of TEA increased from 0.00 M to 0.60 M. As a result, the EMI SE of the composites increased from 10–12 dB to 25–27 dB.
    關聯: Thin Solid Films 517(17), pp.4984–4988
    DOI: 10.1016/j.tsf.2009.03.137
    显示于类别:[化學學系暨研究所] 期刊論文


    档案 描述 大小格式浏览次数
    Electroless deposition of the copper sulfide coating on polyacrylonitrile with a chelating agent of triethanolamine and its EMI Shielding Effectiveness.pdf381KbAdobe PDF0检视/开启



    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回馈