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    Title: 多段層基板によって達成されかつ熱を即座に放散するLEDランプ
    Other Titles: 以多層基板結構散熱之LED 燈具
    Led Lamp Achieved By Multi-Stage Layer Substrate And Dissipating Heat Immediately
    Authors: 康尚文;簡坤誠
    Contributors: 淡江大學機械與機電工程學系
    Date: 2010-08-19
    Issue Date: 2012-05-14 20:45:20 (UTC+8)
    Abstract: 【課題】生成された熱を即座かつ効率的に放散し得るLEDランプを、提供する。
    【解決手段】多段層として並列に形成される複数の基板2とそれぞれ熱的に連結されるLEDアレイおよびマルチチップLEDアレイを含んでいる複数のLEDモジュール1aを有し、基板2の各々は、少なくとも1つの熱放散デバイス3、LEDランプ100のフロント部に取り付けられる透明カバー4、および、LEDランプ100の後方部位に固定され、かつ、熱放散デバイス3の内側部位に連結されるランプシェード5と、熱的に連結されている。基板2は、透明カバー4とランプシェード5との間に、収容されている。熱放散デバイス3は、複数の伝熱ブロック31、複数の水平ヒートパイプ32、複数の縦熱放散フィン33、複数の縦ヒートパイプ34および複数の水平熱放散プレート35を有する。
    PROBLEM TO BE SOLVED: To provide an LED lamp capable of immediately and efficiently dissipating the heat generated.
    SOLUTION: The LED lamp includes a plurality of substrates 2 formed in parallel as a multi-stage layer, and a plurality of LED modules 1a each containing an LED array and a multi-tip LED array thermally coupled with each other. Each substrate 2 is thermally coupled to at least one heat dissipation device 3, a transparent cover 4 attached at a front of an LED lamp 100, and a lamp shade 5 fixed at a rear site of the LED lamp 100 and coupled to an inner side site of the heat dissipation device 3. The substrate 2 is housed between the transparent cover 4 and the lamp shade 5. The heat dissipation device 3 includes a plurality of heat transmission blocks 31, a plurality of horizontal heat pipes 32, a plurality of vertical heat dissipation fins 33, a plurality of vertical heat pipes 34 and a plurality of horizontal heat dissipation plates 35.
    Appears in Collections:[機械與機電工程學系暨研究所] 專利

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