High Power Led Lighting Assembly Assembled With Heat Radiation Module With Heat Pipe

機構典藏 > College of Engineering > Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering > Patent > Item 987654321/76643

Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/76643

Title:	High Power Led Lighting Assembly Assembled With Heat Radiation Module With Heat Pipe
Other Titles:	高功率發光二極體照明燈具與其散熱模組
Authors:	康尚文;Kang, Shung-wen;Tsai, Meng-chang;Chien, Kun-cheng
Contributors:	淡江大學機械與機電工程學系
Date:	2008-10
Issue Date:	2012-05-14 20:43:05 (UTC+8)
Abstract:	PROBLEM TO BE SOLVED: To provide a high power light-emitting diode (LED) lighting assembly. SOLUTION: The high power light-emitting diode (LED) lighting assembly assembling a heat radiation module is provided. A heat exchange base section, at least one LED array, at least one heat pipe, and the heat radiation module are included in the LED lighting assembly. At least one LED array surface for mounting the LED array and at least one hollow section for inserting the heat pipe are included in the heat exchange base section. The LED array is arranged on the LED array surface at a designated projecting angle. A heating section, a cooling section, and a conductive section are included in the heat pipe, and operating fluid is filled in the heat pipe. The heat exchange base section is mounted on the heating section, and the heat radiation module is mounted on the cooling section. Heat energy generated by an LED is conducted into the heating section of the heat pipe from the heat exchange base section, whereby, the operating fluid of the heat pipe is heated and evaporated, and flows to radiate heat from the conductive section to the cooling section in the heat radiation module.
Appears in Collections:	[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Patent

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