一種錫球承載治具，包括有一具有上表面之本體以及一由複數凹設於前述本體之上表面的定位孔所構成的孔穴陣列；藉由回焊等方式加熱而精確地將配置於該孔穴陣列之錫球設置於球柵陣列封裝晶片的底部，藉此可無須採用精密昂貴的機械手臂，以較低成本順利地完成植球。 A ball bearing fixture, including one with the upper surface of the body and one from the plural concave body in the aforementioned hole location on the surface of the hole array posed; by means of reflow heating and precise configuration of the hole array of solder balls located in ball grid array package at the bottom of the chip to be no need for the use of expensive precision mechanical arm in order to lower the cost of the successful completion of the ball-sik.
