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    題名: 蒸汽腔體均溫板之均溫性實驗探討
    其他題名: Experimental study of vapor chamber with temperature uniformity
    作者: 黃瑞彬;Huang, Ruei-Bin
    貢獻者: 淡江大學機械與機電工程學系碩士班
    康尚文
    關鍵詞: 多孔均溫板;蒸汽腔體;均溫性;multi-well heat spreader;Vapor chamber;Temperature Uniformity
    日期: 2011
    上傳時間: 2011-12-28 19:07:29 (UTC+8)
    摘要: 本研究針對不同材質蒸汽腔體均溫板以實驗方法探討均溫性與升溫速率。首先,將銅質均溫板、蒸汽腔體均溫板、蒸汽腔體多孔均溫板三種均溫板於200瓦單一熱源的加熱功率下搭配水冷套進行穩態測試。其次於自然對流條件下,以雙熱源及六熱源分別針對蒸汽腔體多孔均溫板與鋁質多孔均溫板加熱至90℃,探討其時間與溫度變化關係與均溫性。實驗結果顯示,蒸汽腔體均溫板因具較低之擴散熱阻而有較佳之均溫性,其次為蒸汽腔體多孔均溫板與銅質均溫板。於雙熱源及六熱源加熱模組下,蒸汽腔體多孔均溫板之均溫性較鋁質多孔均溫板優異,但鋁質多孔均溫板因較小之熱含量,升溫速率較快。蒸汽腔體均溫板未來可應用於均溫佳且升溫快之需求領域,如生醫聚合酶鏈鎖反應。
    In this paper, experimental method is conducted to study vapor chamber temperature uniformity and its heating rate. Firstly, a steady-state test with a single heat source of 200 watts and with a water cooling set is applied to copper heat spreader, vapor chamber heat spreader and vapor chamber heat spreader with multi-well respectively. Secondly, vapor chamber heat spreader with multi-well and aluminum heat spreader with multi-well are tested under natural convection condition. Applying dual and six heat sources respectively, temperature uniformity and heating rate are studied when the heat spreaders are heated to 90℃. Experimental results shown that vapor chamber heat spreader has the better temperature uniformity due to a lower diffusing thermal resistance, followed by vapor chamber heat spreader with multi-well and copper heat spreader. Vapor chamber heat spreader with multi-well has the better temperature uniformity both in six sources and dual sources mode. Additionally, aluminum heat spreader with multi-well shows the higher heating rate due to a lower heat capacity. The potential applications for the vapor chamber heat spreaders are seen in areas where good temperature uniformity are required with high heating rate such as Polymerase Chain Reaction, (PCR).
    顯示於類別:[機械與機電工程學系暨研究所] 學位論文

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