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    題名: 多孔蒸汽腔體均溫板之均溫性模擬分析
    其他題名: Temperature uniformity analysis of multi-well vapor chamber heat spreader
    作者: 許峻翔;Hsu, Chun-Hsiang
    貢獻者: 淡江大學機械與機電工程學系碩士班
    康尚文;Kang, Shung-Wen
    關鍵詞: 多孔均溫板;蒸汽腔體;均溫性模擬分析;multi-well heat spreader;Vapor chamber;temperature uniformity analysis
    日期: 2011
    上傳時間: 2011-12-28 19:07:10 (UTC+8)
    摘要: 本研究利用計算流體力學CFD軟體在自然對流條件下針對多孔均溫板之均溫性與升溫速率進行模擬分析。多孔均溫板(長112 mm ×寬 75 mm ×高17.2 mm)包含96個直徑5mm、深度10mm孔洞結構,首先分別以雙熱源及六熱源於1200W加熱功率下針對多孔均溫板材質為鋁、銅、銀及蒸汽腔體進行分析比較。其次,以六熱源加熱方式於188、300、600及1200W加熱功率下探討其升溫速率。
    結果顯示,六熱源加熱時之均溫性較雙熱源佳,另於雙熱源及六熱源加熱條件下,蒸汽腔體均溫板因具較高之熱傳導係數而有較佳之均溫性,其次為銀質均溫板、銅質均溫板,與鋁質均溫板。升溫速率則以鋁質與銀質均溫板較快,其次為銅質均溫板,蒸汽腔體均溫板則因較大之熱含量,升溫最為緩慢。均溫板將隨加熱功率之增加而提高升溫速率,但亦同時降低其均溫性。
    In this study, temperature uniformity and heating rate of heat spreaders with multi-well are simulated and analyzed by CFD software under natural convection condition. The heat spreader (112mm in length; 75mm in width and 17.2 mm in thickness) includes 96 holes with a diameter of 5mm and a depth of 10mm. Firstly, multi-well heat spreaders made of aluminum, copper, silver, and vapor chamber are simulated and compared, when dual and six heat sources are applied at a heating power of 1200W. Secondly, with six heat sources at heating power of 188, 300, 600, and 1200W, the heating rate of heat spreaders are studied. Results shown that temperature uniformity in six heat sources mode is better than dual sources mode. Vapor chamber heat spreader has the better temperature uniformity both in six sources and dual sources mode due to a higher thermal conductivity, followed by silver, copper and aluminum heat spreader. Aluminum and silver heat spreader show the higher heating rate, followed by copper heat spreader, vapor chamber heat spreader due to a larger heat capacity, heat up the slowest. Furthermore, with the heating power increasing, the heating rate of heat spreader is increasing, but also reduces the temperature uniformity.
    顯示於類別:[機械與機電工程學系暨研究所] 學位論文

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