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    题名: Fabrication and test of vapor chamber heat spreader
    其它题名: 蒸汽腔體均溫板之研製與測試
    作者: 蔡孟昌;Tsai, Meng-Chang
    贡献者: 淡江大學機械與機電工程學系博士班
    康尚文;Kang, Shung-Wen
    关键词: 蒸汽腔體;Vapor chamber;均溫板;平板熱管;Heat Spreader;Plate Heat Pipe
    日期: 2011
    上传时间: 2011-12-28 19:06:25 (UTC+8)
    摘要: 本論文對蒸汽腔體均溫板(Vapor Chamber Heat Spreader, VCHS)提出廣泛性的研究工作。研製多種規格的均溫板,探討工作流體充填率與其熱傳性能的變化。並透過實驗數據分析均溫板在電子冷卻應用的影響。
    研究改變五個不同的均溫板傾斜角(0°, 45°, 90°, 135°, 180°),結果顯示在不同的傾斜角度重力對均溫板熱傳性能的影響不大,僅在90°垂直擺放時有些微差距,顯示均溫板有很好的抗重力效果。
    實驗設計將傳統單一的整體熱阻,分成擴散熱阻、一維傳導熱阻與冷凝熱阻,測試結果顯示擴散熱阻是影響性能的一個主導因子,可以有效代表均溫板的性能特性。另外,研究顯示無論是在空冷或水冷的測試條件下,都可以有效的利用均溫板來提升系統的性能。
    本研究針對具發展潛能的工業應用提出均溫板的設計,數值分析與測試,結果顯示均溫板在多熱源的條件下,有良好的均溫效果,可有效取代刀鋒伺服器,通訊系統與LED的散熱模組。
    This dissertation presents a comprehensive research work on the vapor chamber heat spreader (VCHS). Base on the experimental data this study try to regarding parametric effects of VCHS to the electronic cooling applications. A series of prototype vapor chamber heat spreaders with different working fluid filling ratios have been fabricated and tested their thermal performances.
    To investigate the influence of the gravity on the VCHS performance, some tests were conducted under 0, 45, 90, 135, and 180 degree, five different tilt angles. It was shown that they have almost the same performance, and with little difference for the case of vertical install. The results also showed that the spreading resistance has the same trend with total thermal resistance which is a combination of the one-dimension, spreading, and condensing resistance. The spreading resistance is the dominating factor in determining the overall thermal resistance of a vapor chamber. VCHS can enhance the system performance both in air and water cooling tests.
    In this research, several VCHS with heat sink design and simulation works have been done for potential industrial applications. VCHS shows great performance under multiple heat sources condition and replaces traditional cooling modules in Blade Server, Communication System and multiple LED chips effectively.
    显示于类别:[機械與機電工程學系暨研究所] 學位論文

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