|摘要: ||在技術與資本密集之高科技電子產業，整個半導體零組件供應鏈呈現專業分工態勢。整個產業從標準規格制定、上游的IC設計與晶圓生產、到下游的封裝測試、Chip Set整合與電路設計、到最後的系統生產組裝。|
In the technical and capital-intensive high-tech electronic industry, the fabrication of semiconductor components involves several professional processes. It starts from the setup of standards, then comes through the front end sides of IC design and foundry process, and finally comes to the back end sides of IC testing, chip set integration, system design and package assembly. After the blooming development in recent years, Taiwan has played an important role in the highly competitive semiconductor industry on up stream digital and analog IC design, middle stream process foundry service and mask development, and down stream electronic system fabrication.
In the trend of international openness and the electronic system company elimination, the industry environment and market has been changed quickly. The bigger commercial distributors could hold more advantageous resources than the mid and small sized distributors. In this highly compete, lot merge alliance and slight profit environment, the mid and small sized distributors not only have to provide more technical consultant, cash flow or logistic service, but also have the way to face the business change.
The thesis makes a study of the mid and small sized distributors facing problem and seeking unique competitive advantages to achieve the objective as below.
1. To discuss the industry environment, the competition relations, and the future trend of the semiconductor component distributors.
2. To make a thorough inquiry on the management state of the mid-sized semiconductor component distributor by a case analysis, and to realize its strategy and the core technical competence.
3.To provide an effective suggestion for mid-sized semiconductor component distributors for making management strategy on limited resources.