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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/72750

    Title: A Novel SiGe raised source/drain polycrystalline silicon thin-film transistor with improved on-current and larger breakdown voltage
    Authors: Yeh, P.H.;Peng, D.Z.;Chang, T.C.;Liu, C.F.
    Contributors: 淡江大學物理學系
    Date: 2002-11
    Issue Date: 2011-10-24 11:06:41 (UTC+8)
    Abstract: A novel poly-Si thin-film transistor with a self-aligned SiGe raised source/drain (SiGe-RSD TFT) has been proposed and fabricated. The SiGe-RSD regions were grown selectively by the ultra-high vacuum chemical vapor deposition (UHVCVD) process designed by us at 550°C. The resultant transistor structure features an ultra-thin active channel region (20 nm) and a self-aligned thick source/drain region (120 nm), and is ideally suited for optimum performance. Significant improvements in electrical characteristics, such as higher turn-on current, lower leakage current and higher drain breakdown voltage have been observed in the SiGe RSD TFT, compared to its conventional TFT counterpart. Moreover, the process is simple and no additional masks are necessary, which is consistent with conventional fabrication processes.
    Relation: Japanese Journal of Applied Physics 42, pp.1164-1167
    Appears in Collections:[物理學系暨研究所] 期刊論文

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