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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/7231


    Title: 精密輪磨加工矽晶圓表面性狀研究:(樹脂砂輪)鑽石輪磨與電解線上削銳輪磨之比較分析
    Other Titles: AStudy of the Surface Morphology and Sub-surface Characteristics of Single Crystal Silicon Generated by ELID-Grinding and (Resin-Bonded) Diamond Grinding
    Authors: 趙崇禮;簡錫新;馬廣仁
    Contributors: 淡江大學機械與機電工程學系
    Keywords: 輪磨;鑽石輪磨;晶圓表面;Grinding;Diamond grinding;Wafer surface
    Date: 2001
    Issue Date: 2009-03-16 16:00:28 (UTC+8)
    Appears in Collections:[機械與機電工程學系暨研究所] 研究報告

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