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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/71794

    Title: Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing
    Authors: Tsai, Tzu-hsuan;Wu, Y. F.
    Contributors: 淡江大學化學工程與材料工程學系
    Keywords: Chemical mechanical polishing;Copper;Nonionic surfactant;Stability;Viscosity;Wettability
    Date: 2006-06
    Issue Date: 2013-05-31 11:40:38 (UTC+8)
    Publisher: Philadelphia: Taylor & Francis Inc.
    Abstract: During copper chemical mechanical polishing (Cu-CMP), the physical properties of slurry, such as the dispersion and suspension stability of abrasives, the interaction between particles and the polished surface, and the rheological characteristics, greatly affect the planarization efficiency. In this study, several nonionic surfactants were added to change the aforementioned physical characteristics of slurry and Cu-CMP performance. Their effects were investigated. The experimental results showed that Al2O3 slurry with 300 ppm Triton DF-16 could enhance the wettability of the Cu surface and stabilize the dispersion of abrasives in the slurry. Therefore, the passivation reaction on the Cu surface during CMP would occur uniformly, and the removal of particles during post cleaning could be improved. Cu CMP using the slurry with an adequate amount of nonionic surfactants, Triton DF-16, is proposed to reduce the surface roughness, enhancing the planarity.
    Relation: Chemical Engineering Communications 193 (6), pp.702-714
    DOI: 10.1080/00986440500265901
    Appears in Collections:[化學工程與材料工程學系暨研究所] 期刊論文

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