Localized Corrosion Effects and Modifications of Acidic and Alkaline Slurries on Copper Chemical Mechanical Polishing

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Title:	Localized Corrosion Effects and Modifications of Acidic and Alkaline Slurries on Copper Chemical Mechanical Polishing
Authors:	Tsai, Tzu-hsuan;Yen, Shi-chern
Contributors:	淡江大學化學工程與材料工程學系
Keywords:	Chemical mechanical polishing;Copper;Pitting corrosion;Alumina slurry;Potentiodynamic curve;Surface roughness
Date:	2003-04-15
Issue Date:	2011-10-24 01:37:40 (UTC+8)
Relation:	Applied Surface Science 210(3-4), pp.190-205
DOI:	10.1016/S0169-4332(02)01224-2
Appears in Collections:	[Graduate Institute & Department of Chemical and Materials Engineering] Journal Article

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