淡江大學機構典藏:Item 987654321/70732
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 62805/95882 (66%)
造访人次 : 3918240      在线人数 : 627
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜寻范围 查询小技巧：
  • 您可在西文检索词汇前后加上"双引号"，以获取较精准的检索结果
  • 若欲以作者姓名搜寻，建议至进阶搜寻限定作者字段，可获得较完整数据
    •  进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/70732


    题名: Development of Thermal Spreading Technology Nowadays
    作者: Kang, Shung-wen;Tsai, Meng-chang;Weng, Ming-tai;Hsu, Chao-hsiang
    贡献者: 淡江大學機械與機電工程學系
    日期: 2009-10
    上传时间: 2011-10-23 21:43:20 (UTC+8)
    出版者: IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY (IEEE CPMT-Taipei)
    摘要: Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.
    關聯: Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International, pp.328-335
    DOI: 10.1109/IMPACT.2009.5382184
    显示于类别:[機械與機電工程學系暨研究所] 會議論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    Development ofThermal Spreading Technology Nowadays.pdf全文檔15516KbAdobe PDF878检视/开启
    index.html0KbHTML343检视/开启

    在機構典藏中所有的数据项都受到原著作权保护.

    TAIR相关文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回馈