Development of Thermal Spreading Technology Nowadays

機構典藏 > College of Engineering > Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering > Proceeding > Item 987654321/70732

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Title:	Development of Thermal Spreading Technology Nowadays
Authors:	Kang, Shung-wen;Tsai, Meng-chang;Weng, Ming-tai;Hsu, Chao-hsiang
Contributors:	淡江大學機械與機電工程學系
Date:	2009-10
Issue Date:	2011-10-23 21:43:20 (UTC+8)
Publisher:	IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY (IEEE CPMT-Taipei)
Abstract:	Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.
Relation:	Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International, pp.328-335
DOI:	10.1109/IMPACT.2009.5382184
Appears in Collections:	[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Proceeding

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