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    题名: Development of Thermal Spreading Technology Nowadays
    作者: Kang, Shung-wen;Tsai, Meng-chang;Weng, Ming-tai;Hsu, Chao-hsiang
    贡献者: 淡江大學機械與機電工程學系
    日期: 2009-10
    上传时间: 2011-10-23 21:43:20 (UTC+8)
    出版者: IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY (IEEE CPMT-Taipei)
    摘要: Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.
    關聯: Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International, pp.328-335
    DOI: 10.1109/IMPACT.2009.5382184
    显示于类别:[機械與機電工程學系暨研究所] 會議論文

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