Study of thickness and grain size effects on material behavior in micro-forming

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题名:	Study of thickness and grain size effects on material behavior in micro-forming
作者:	Yeh, Fung-Huei;Li, Ching-Lun;Lu, Yuung-Hwa
贡献者:	淡江大學機械與機電工程學系
关键词:	thickness;grain size;material behavior;micro-forming
日期:	2007-10
上传时间:	2011-10-23 21:40:28 (UTC+8)
出版者:	Daejeon: The Korea Advanced Institute of Science and Technology
摘要:	With the development of the technology, miniature and portability become the trends in manufacturing business. It is more and more important to miniaturize blank size in micro-forming process as well. Therefore, the researchers of micro-forming focus on this trend and try their best to study the problems and find the best solution. This paper presents an effective and practical mathematical modeling to describe the material behavior of any thickness and any grain size in micro-forming. Using this modeling, the cylindrical micro-cup deep drawing is analyzed by explicit dynamic finite element method. The simulation results show that thickness variety and stress distribution are reasonable. This investigation proves that the new mathematical modeling of material behavior will supply a useful modeling which takes into account the thickness and grain size effects in micro-forming.
關聯:	Proceedings of 10th International Conference on Advances in Materials and Processing Technologies (AMPT2007), 5p.
DOI:	10.1016/j.jmatprotec.2007.11.138
显示于类别:	[機械與機電工程學系暨研究所] 會議論文

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