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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/6874

    Title: 電鍍法製備Co/Cu多層膜界面特性研究
    Other Titles: Interfacial Characteristics in Co/Cu Multilayers Prepared by Electrodeposition
    Authors: 張裕祺
    Contributors: 淡江大學化學工程與材料工程學系
    Keywords: 鈷/銅多層膜;電極動力學;界面
    Date: 2004
    Issue Date: 2009-03-16 15:12:31 (UTC+8)
    Abstract: 對於提高數儲存密度的需求長期以來是推動磁性薄膜工藝發展的動力。近年 來在鈷/銅及鎳/銅等多層膜系統中所發現的巨磁阻效應,表明這些系統具有提高 紀錄的特性,因而吸引許多研究人員的注意。由於一般言Co 系統材料的磁化較 強,因此本研究乃選定Co/Cu 多層膜為研究對象。 又有研究提及巨磁阻效應與磁性及非磁性薄層的界面特性有關,而由材料的 研究經驗可推知界面特性和界面電化學過程亦當有關,因此本計劃乃擬用電化學 交流阻抗法配合掃瞄電子顯微鏡,X-光繞射及能量分散式X-光微分析等方法來 探討界面電極過程的特徵。此計劃之研究成果信將對多層膜界面特性之掌控提供 有用資訊。
    Appears in Collections:[Graduate Institute & Department of Chemical and Materials Engineering] Research Paper

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