Heat Transfer Prediction of Recycle Effect for Improved Device Performance in Cool-Thermal Discharge Systems

淡江大學機構典藏 > 工學院 > 化學工程與材料工程學系暨研究所 > 期刊論文 > Item 987654321/65513

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题名:	Heat Transfer Prediction of Recycle Effect for Improved Device Performance in Cool-Thermal Discharge Systems
作者:	Ho, Chii-Dong;Huang, Jun-Wei;Tu, Jr-Wei
贡献者:	淡江大學化學工程與材料工程學系
日期:	2008-07-02
上传时间:	2011-10-21 16:30:20 (UTC+8)
出版者:	Taylor & Francis Inc.
摘要:	This research studies the heat transfer characteristic of an unsteady close-contact melting on a flat plate in the cool-thermal discharge systems with external recycle, develops the mathematical model theoretically to simulate the conduction-convection heat-transfer phenomena, and calculates the theoretical prediction of the outlet chilled air temperature by solving the energy balance associated with integral boundary-layer analysis. It is found that the recycle effect can enhance the average Nusselt numbers and heat-transfer efficiency improvement effectively. Three numerical examples of inlet ambient air temperature are illustrated to compute the chilled air temperature, average Nusselt numbers and heat-transfer efficiency with three specified volumetric flow rate and three traversed length of the ambient inlet air as parameters.
關聯:	Numerical Heat Transfer, Part A: Applications 54(7), pp.709-725
DOI:	10.1080/10407780802339130
显示于类别:	[化學工程與材料工程學系暨研究所] 期刊論文

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