With the improvement of circuit density and operating speed, more heat is generated by the electronic elements. Heat dissipation has become a significant issue in efficiency promotion and stable operation. Silicon based micro heat sinks and micro heat pipes fabricated by MEMS technology may provide new ideas and approach of efficient cooling. Experimental tests and theoretical analysis were conducted to investigate the characteristics of fluid flow and flow and heat transfer in these micro cooling elements. Especially, subjected to the mechanism of bubble nucleation, thermal conductivity of micro heat pipe and the possibility of monitoring measurements inside micro channel. 隨著電子元件速度增快，發熱量日益升高，散熱成了提升元件性能與穩定運作的重要課題。以微機電製程所製作的矽質微流道熱沉與微熱管均熱片，提供另一種新的散熱思維與途徑。本文以實際微機電元件之製作測試及相關簡要的數據分析，探討此二種矽質微流道散熱元件的流力特性及相變化熱傳性能，特別是針對微流道中的氣泡成核機制、微熱管的熱傳導係數、以及微流道內部監控量測的可行性，作一回顧式的報告。
關聯:
臺灣大學工程學刊=Bulletin of the College of Engineering, National Taiwan University 80，頁59-77
