淡江大學機構典藏:Item 987654321/65378
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 62822/95882 (66%)
Visitors : 4028436      Online Users : 583
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/65378


    Title: Research on Fabricating CVD Diamond Microstructures Using RIE Process
    Authors: Chou, Wen-chen;Chao, Choung-lii;Fan, Wei-haw;Ma, Kung-jeng
    Contributors: 淡江大學機械與機電工程學系
    Keywords: CVD Diamond;Mask;Microstructure;RIE
    Date: 2009-02
    Issue Date: 2011-10-20 21:44:41 (UTC+8)
    Publisher: Stafa-Zurich: Trans Tech Publications Ltd.
    Abstract: Diamond is one of the most important engineering materials for its extreme hardness, high thermal conductivity value and chemical inertness. Due to its high hardness and strength, it can be ideal candidates for AFM probe or micro-needle. In this research, micro cone-like shaped diamond tips with high aspect ratio formed using reactive ion etching (RIE) method. The scanning electron microscope (SEM), transmission electron microscope (TEM) and micro-Raman spectroscopy were used to study the surface morphology and sub-surface micro-structure before and after RIE process. The results showed that gold could be adopted as mask material during the RIE process. Different microstructures could be obtained using different RIE parameters such as etch duration and reactant gas. After RIE (O2 50sccm, 200W) for 5min the micro cone-like structures (aspect ratio~8) could be observed on the surface if a thin layer of gold was applied as mask. However, under the same RIE conditions, the irregular pillar-like microstructures started to emerge if the etching time was stretched longer.
    Relation: Key Engineering Materials 407-408, pp.41-44
    DOI: 10.4028/www.scientific.net/KEM.407-408.41
    Appears in Collections:[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Journal Article
    [Graduate Institute & Department of Computer Science and Information Engineering] Journal Article

    Files in This Item:

    File SizeFormat
    index.html0KbHTML23View/Open

    All items in 機構典藏 are protected by copyright, with all rights reserved.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback