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    题名: Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding
    作者: Chen, Y. J.;Chang, C. C.;Lin, H. Y.;Hsu, S. C.;Liu, C. Y.
    贡献者: 淡江大學化學工程與材料工程學系
    日期: 2012-02
    上传时间: 2011-10-18 21:31:12 (UTC+8)
    出版者: Kidlington: Pergamon
    摘要: Vertical thin-GaN LED was successfully fabricated on the GaN LED epi-layers grown on the patterned-sapphire substrate with the pyramidal pattern by low-temperature Cu/Sn/Ag wafer bonding at 150 °C. An inverted pyramidal pattern formed on the n-GaN surface after the GaN epi-layer was transferred onto Si wafer, which resulted from the pyramidal pattern on the patterned-sapphire substrate. The inverted pyramidal pattern has an equivalent function with roughening the n-GaN surface. With higher inverted pyramidal pattern coverage, the light extraction efficiency can be greatly enhanced. In addition, we found that the 4-fold increase (from 13.6% to 53.8%) in the pyramidal pattern coverage on patterned-sapphire substrate only gives the GaN LED epi-layer about 5.7% enhancement in the internal quantum efficiency.
    關聯: Microelectronics Reliability 52(2), pp.381–384
    DOI: 10.1016/j.microrel.2010.11.010
    显示于类别:[化學工程與材料工程學系暨研究所] 期刊論文

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