淡江大學機構典藏:Item 987654321/60412
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 62797/95867 (66%)
Visitors : 3734973      Online Users : 401
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/60412


    Title: The Optimum Column Number for the Best Performance of Thermal Diffusion in the Frazier Scheme with the Total Sum of Column Height Fixed
    Authors: Yeh, Ho-Ming;Chen, Liu Yi
    Contributors: 淡江大學化學工程與材料工程學系
    Keywords: Frazier scheme;optimum column number;thermal diffusion;total sum of column height fixed
    Date: 2010
    Issue Date: 2011-10-13 22:39:55 (UTC+8)
    Publisher: Philadelphia: Taylor & Francis Inc.
    Abstract: The effect of column number N, as well as the column height h of thermal diffusion columns, on the degree of separation in the Frazier scheme with the total sum of the column height L (=Nh) fixed, has been investigated. The equations, which may be employed to predict the optimum column number N* for the maximum separation Δ N,max, have been derived. Considerable performance in separation is obtainable if the column number, as well as the column height, in a Frazier scheme with the total sum of the column height fixed is properly assigned for a certain flow-rate operation.
    Relation: Separation Science and Technology 45(8), pp.1051-1057
    DOI: 10.1080/01496391003697085
    Appears in Collections:[Graduate Institute & Department of Chemical and Materials Engineering] Journal Article

    Files in This Item:

    File SizeFormat
    index.html0KbHTML206View/Open

    All items in 機構典藏 are protected by copyright, with all rights reserved.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback