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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/59813


    Title: An Energy-Efficient Hole-Healing Mechanism for Wireless Sensor Networks with Obstacles
    Authors: Chang, Chih-yung;Lin, Chih-yu;Yu, Gwo-jong;kuo, chin-hwa
    Contributors: 淡江大學資訊工程學系
    Keywords: Deployment;Coverage quality;Repair;Sensor network;Robot
    Date: 2011-02
    Issue Date: 2011-10-05 22:17:48 (UTC+8)
    Publisher: John Wiley & Sons
    Abstract: In wireless sensor networks (WSNs), coverage of the monitoring area represents the surveillance quality. Since sensor nodes are battery powered and placed outdoor, there will be failures due to energy exhaustion or environmental influence, resulting in coverage-loss. In literature, a number of studies developed robot repairing algorithms that aim at maintaining full coverage. However, they did not consider the time constraint for network maintenance. Furthermore, they did not consider the existence of obstacles and the constraint of limited energy of the robot. This paper presents a novel tracking mechanism and robot repairing algorithm for maintaining the coverage quality of the given WSN. Without support of location information, the tracking mechanism leaves robot's footmark on sensors so that they can learn better routes for sending repairing requests to the robot. Upon receiving several repairing request messages, the robot applies the proposed repairing algorithm to establish an efficient route that passes through all failure regions with low overhead in terms of the required time and the power consumption. In addition, the proposed repairing algorithm also considers the remaining energy of the robot so that the robot can move back to home for recharging energy and overcome the unpredicted obstacles. Performance results reveal that the developed protocol can efficiently maintain the coverage quality while the required time and energy consumption are significantly reduced.
    Relation: Wireless Communications and Mobile Computing 13(4), pp.377–392
    DOI: 10.1002/wcm.1106
    Appears in Collections:[資訊工程學系暨研究所] 期刊論文

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